COF Dry Film Laminator
Widely used in BGA/CSP printer heads and HDDs, etc.
●Effective width: 60 to 160 mm ●Cleaning method: Adhesive rubber roll transfer method ●Pressurization method: Air cylinder pressurization ●Film slitting: One-touch set, upper and lower ●Machine dimensions: W1100 × D4000 × H1800 mm ●Air source: 0.4 MPa or more ●Power supply: φ3 200V 50/60Hz ●Weight: 3000 kg
- Company：エム・シー・ケー 東京 電子事業本部
- Price：Other
